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LTM8042/LTM8042-1
APPLICATIONS INFORMATION
The most appropriate way to use the coefficients is when
running a detailed thermal analysis, such as FEA, which
considers all of the thermal resistances simultaneously.
None of them can be individually used to accurately pre-
dict the thermal performance of the product, so it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature versus load graphs
given in the LTM8042/LTM8042-1 data sheet.
A graphical representation of these thermal resistances
is given in Figure 5.
The die temperature of the LTM8042/LTM8042-1 must be
lower than the maximum rating of 125°C, so care should
be taken in the layout of the circuit to ensure good heat
sinking of the LTM8042/LTM8042-1. The bulk of the
heat flow out of the LTM8042/LTM8042-1 is through the
bottom of the module and the LGA pads into the printed
circuit board. Consequently, a poor printed circuit board
design can cause excessive heating, resulting in impaired
performance or reliability. Please refer to the PCB Layout
section for printed circuit board design suggestions.
The blue resistances are contained within the μModule
regulator, and the green are outside.
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
JUNCTION-TO-CASE (TOP)
RESISTANCE
CASE (TOP)-TO-AMBIENT
RESISTANCE
JUNCTION
JUNCTION-TO-BOARD RESISTANCE
At
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
CASE (BOTTOM)-TO-BOARD
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
80421 F05
μMODULE DEVICE
Figure 5
TYPICAL APPLICATIONS
Boost Operation, Driving 6 White LEDs at 1A
V IN
11.6V TO 19V
V CC
LTM8042
LED +
UP TO 20.6V
RUN
BSTIN/BKLED –
TG
PWM
SYNC
TGEN
SS
BSTOUT/BKIN
1A
4.7μF
RT
22.6k
GND CTL
4.7μF
f SW = 750kHz
80421 TA02
80421fa
27
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